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Beginning 1962 Current
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For nearly four decades, Hemlock Semiconductor Corporation has been a leading supplier of polycrystalline silicon.
 

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2006 Finished Phase 3 of PHARO III expansion

2005 Started Phase 1 of SOLAR I expansion to achieve 19,000MT capacity

2004 Started Phase 3 of PHARO III expansion to achieve 10,000MT capacity  

  

2001 HSC enters Solar market as a manufacturer of a grade of polysilicon specifically for Solar Industry

1999 Completion of Phase 2 of PHARO III expansion to achieve 6200MT capacity

 1998 The scheduled completion of PHARO III, Phase II, expansion will add 35 percent more polycrystalline silicon production. Finishing expansion and technology enhancements will provide an ultra-clean polycrystalline silicon product in anticipation of future 300-400 mm wafer supply requirements.

1997 The completion of PHARO III, Phase I expansion resulted in an additional 40 percent polycrystalline silicon production capacity.

1995 The completion of PHARO II, Phase II, expansion resulted in a total site capacity of 4000 metric tons per year of polycrystalline silicon production.

1994 Hemlock Semiconductor became the worlds largest producer/supplier of polycrystalline silicon. (Completion of PHARO II, Phase I, expansion). 

 

 

 

 

1992 Hemlock Semiconductor Corporation expanded its polycrystalline silicon production capacity by 20 percent and achieved ISO 9002 registration.

1989 The use of clean room processing for polycrystalline silicon finishing operations was improved and expanded.

1986 Hemlock Semiconductor Corporation tripled its previous capacity, focusing on leading-edge process technology, advanced chemical purification and parts-per-trillion analysis techniques.

1984 Hemlock Semiconductor Corporation became a Joint Venture of Dow Corning and two of Japan's largest single-crystal wafer manufacturers, Shin-Etsu Handotai Co., Ltd. and Mitsubishi Materials Corporation.

1979 Hemlock Semiconductor Corporation was formed as a wholly owned subsidiary of Dow Corning Corporation.

1969 The end of a decade in which Hemlock doubled its manufacturing capabilities three times, largely due to the growth of the electronics industry.

1960 The Hemlock, Michigan, site was selected for the first fully integrated polycrystalline silicon plant.

1957 Dow Corning corporation implemented technology to manufacture polycrystalline silicon.