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Hemlock Semiconductor
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A Timeline of Industrial Leadership

1957Dow Corning Corporation implements technology to manufacture
polycrystalline silicon.
1960Hemlock Semiconductor’s Michigan site is selected for the first fully integrated
polycrystalline silicon plant.
1961Polycrystalline silicon production begins.
1969The end of a decade in which the site doubles its manufacturing capabilities
three times, largely due to the growth of the electronics industry.
1979Hemlock Semiconductor Corporation is formed as a wholly-owned subsidiary
of Dow Corning Corporation.
1984Hemlock Semiconductor Corporation becomes a joint venture of Dow Corning
and two of Japan’s largest single-crystal wafer manufacturers, Shin-Etsu
Handotai Co., Ltd. and Mitsubishi Materials Corporation.
1986Hemlock Semiconductor Corporation triples its previous capacity, focusing on
leading-edge processing technology, advanced chemical purification, and
parts-per-trillion analysis techniques.
1989The use of cleanroom processing for polycrystalline silicon finishing operations
was improved and expanded.
1992Hemlock Semiconductor Corporation expands its polycrystalline silicon
production capacity by 20 percent and achieves ISO 9002 registration.
1994Hemlock Semiconductor Corporation becomes one of the world’s largest
producers/suppliers of polycrystalline silicon.
1995A major expansion results in a total site capacity of 4,000 MT per year of
polycrystalline silicon production.
1997Another significant expansion results in an additional 40 percent polycrystalline
silicon production capacity.
1999The site increases production to 6,200 MT. Technology advancements provide
an ultra-clean polycrystalline silicon product in anticipation of future 300-400
mm wafer supply requirements.
2002ISO 9001:2000 certification achieved. Hemlock Semiconductor Corporation
enters the market as a manufacturer of solar-grade polysilicon.
2005$500 million expansion that will increase capacity by 100 percent announced;
construction begins.
2006The Michigan site increases production to 10,0000 MT. “Solar 2” production
capacity expansion is approved and contracted for up to 19,000 MT, starting in
2009 a global “Green Site” search for a second production location is initiated.
2007$1 billion expansion to increase the company’s total annual output of
polysilicon to 36,000 metric tons announced.
2008A $1 billion expansion in Michigan and $1.2 billion investment in a new plant in
Tennessee are announced.
2009Site construction begins at a new plant in Tennessee; new capacity is brought
on line in Michigan.
2010Vice President Joe Biden tours Michigan site; Tennessee site project team
moves into the first on-site building.
2011Hemlock Semiconductor celebrates 50th anniversary.

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