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Hemlock Semiconductor
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A Timeline of Industrial Leadership

2018Hundreds of employees of Hemlock Semiconductor (HSC) called on President Donald Trump to take action on behalf of U.S.(PDF) polysilicon manufacturing and work to restore the polysilicon industry’s access to China which would sustain U.S. polysilicon manufacturing jobs and create opportunities for growth in Michigan and across the U.S.
2016Ownership change, following the restructure of ownership of Dow Corning Corporation to become a wholly-owned subsidiary of The Dow Chemical Company. Hemlock Semiconductor Group is composed of several joint venture companies owned by The Dow Chemical Company, Corning Inc. and Shin-Etsu Handotai.
2014Hemlock Semiconductor Corporation announced the permanent closure of the Tennessee plant, due to adverse industry conditions and ongoing challenges from Chinese imposition of significant duties on imports of polycrystalline silicon from the U.S.
2013The Michigan Department of Environmental Quality (DEQ) designated Hemlock Semiconductor’s Michigan site as a member of the state’s Clean Corporate Citizen (C3) Program. Membership in the C3 Program is one of the DEQ’s highest environmental stewardship achievements.
2012In 2012, the U.S. imposed duties on imports of Chinese and Taiwanese solar cells and modules, after finding that the Chinese were flooding the U.S. market with cheap panels and harming the ability of U.S. panel makers to sell their products. China also filed a trade action targeting U.S. polysilicon, the fundamental building block for solar cells and modules, and imposing significant duties on imports from the United States beginning in 2014.
2011Hemlock Semiconductor celebrates 50th anniversary.
2010Vice President Joe Biden tours Michigan site; Tennessee site project team moves into the first on-site building.
2009Site construction begins at a new plant in Tennessee; new capacity is brought on line in Michigan.
2008A $1 billion expansion in Michigan and $1.2 billion investment in a new plant in Tennessee are announced.
2007$1 billion expansion to increase the company’s total annual output of polysilicon to 36,000 metric tons announced.
2006The Michigan site increases production to 10,0000 MT. “Solar 2” production capacity expansion is approved and contracted for up to 19,000 MT, starting in 2009 a global “Green Site” search for a second production location is initiated.
2005$500 million expansion that will increase capacity by 100 percent announced; construction begins.
2002ISO 9001:2000 certification achieved. Hemlock Semiconductor Corporation enters the market as a manufacturer of solar-grade polysilicon.
1999The site increases production to 6,200 MT. Technology advancements provide an ultra-clean polycrystalline silicon product in anticipation of future 300-400mm wafer supply requirements.
1997Another significant expansion results in an additional 40 percent polycrystalline silicon production capacity.
1995A major expansion results in a total site capacity of 4,000 MT per year of polycrystalline silicon production.
1994Hemlock Semiconductor Corporation becomes one of the world’s largest producers/suppliers of polycrystalline silicon.
1992Hemlock Semiconductor Corporation expands its polycrystalline silicon production capacity by 20 percent and achieves ISO 9002 registration.
1989The use of cleanroom processing for polycrystalline silicon finishing operations was improved and expanded.
1986Hemlock Semiconductor Corporation triples its previous capacity, focusing on leading-edge processing technology, advanced chemical purification, and parts-per-trillion analysis techniques.
1984Hemlock Semiconductor Corporation becomes a joint venture of Dow Corning and two of Japan’s largest single-crystal wafer manufacturers, Shin-Etsu Handotai Co., Ltd. and Mitsubishi Materials Corporation.
1979Hemlock Semiconductor Corporation is formed as a wholly-owned subsidiary of Dow Corning Corporation.
1969The end of a decade in which the site doubles its manufacturing capabilities three times, largely due to the growth of the electronics industry.
1961Polycrystalline silicon production begins.
1960Hemlock Semiconductor’s Michigan site is selected for the first fully integrated polycrystalline silicon plant.
1957Dow Corning Corporation implements technology to manufacture polycrystalline silicon.

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