New executive position focuses on innovation and continuous improvement in HSC polysilicon manufacturing processes
Hemlock, Mich. – Hemlock Semiconductor, the nation’s leading manufacturer of hyper-pure polysilicon for the semiconductor and solar industries, today announced that Roy Furbank has joined the company’s executive leadership team as Vice President – Process Engineering, a new position that highlights the critical importance of driving innovation and continuous improvements across HSC’s manufacturing processes.
Vice President of Process Engineering
Furbank reports directly to HSC Chairman and CEO AB Ghosh and is responsible for improving and sustaining HSC’s process capabilities in the production of hyper-pure polysilicon. He leads a team that oversees productivity and project-based improvements, quality control, integrating product research and development, and optimizing manufacturing processes across the enterprise. Furbank started today in his new role.
“In today’s growing and hyper-competitive market for semiconductor-grade polysilicon, HSC’s new process engineering team will focus on continuous improvements in our production processes to ensure that we continue to manufacture the purest polysilicon on the planet,” Ghosh said. “Roy Furbank’s leadership skills, deep expertise in chemical manufacturing and extensive global business experience will make him a tremendous asset to the HSC team as we work to stay on the cutting edge of polysilicon technology.”
“It’s an exciting time to join Hemlock Semiconductor,” Furbank said. “My goal is to take HSC’s production processes to the next level to ensure that our polysilicon is driving the next generation of semiconductor chips and solar components.”
Furbank joins HSC from Axalta Coating Systems, based in Philadelphia, PA, where he most recently held the position of Global Process Technology Director across 25+ manufacturing sites and laboratories. Prior to Axalta, he held various roles at Rohm and Haas and The Dow Chemical Company’s Coatings business. Before leaving Dow, Furbank was a Global Improvement leader in the Advanced Polymer Process Technology Center. He also served in the U.S. Army on active duty for four years as a Combat Engineer Officer after completing ROTC and receiving his bachelor’s degree.
Furbank holds a Ph.D. in Chemical and Biomolecular Engineering from the Georgia Institute of Technology, a Bachelor of Science in Chemical Engineering from the University of Texas at Austin, and was valedictorian in the Engineering Officer Basic Course, United States Army Engineer School.
He and his wife, Trish, will be relocating to the Great Lakes Bay Region from Philadelphia.
A photo of Furbank is available here.
About Hemlock Semiconductor
Hemlock Semiconductor Operations (HSC) is a leading provider of hyper-pure polycrystalline silicon and other silicon-based products used in the manufacture of semiconductor devices, solar cells and modules. At HSC, we’re passionate about silicon-based technology and its unique potential to connect and energize the world we share. HSC’s polysilicon enables customers to produce high-tech electronics and solar energy, and our efficient manufacturing process delivers products with an ultra low-carbon footprint. HSC began operations in 1961 and is owned by Corning Incorporated and Shin-Etsu Handotai.
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